DescriptionWe design and develop RF analogue, mixed-signal and digital integrated circuits and systems for wireless communications applications up to 86GHz. The close collaboration with the antennas group allows us to customize complete low-cost system solutions with a very low form factor for cutting-edge medical applications, high speed communications and imaging, wireless identification and monitoring of processes.
We develop solutions, from IC development, prototype assembly and small batch delivery to highest quantities for mass production. We also offer our expertise for feasibility studies, technology consulting and support at production start. Our services cover a wide range of applications, such as:
Complete integrated transceivers for Wireless Communications (both RF / analog front-end and mixed-signal /digital back-end)
Digital baseband processors
High data rate wireless communication links for backhaul applications
Custom RF & analogue circuit design and characterization (on-wafer and on PCB)
Intellectual Property (IP) digital cores
Complete Solutions for active / passive RF Identification Systems (RFID)
Real-Time Location Systems
Low-power batteryless integrated sensors and Wireless Sensor Networks
Ultra low-power ICs for energy management and micro-power harvesting
RF passive components modelling and characterization (inductor, varactor, ESD devices)
Basamos nuestros diseños en tecnologías basadas en silicio de última generación, tales como CMOS, BiCMOS y SiGe. Tenemos experiencia en la implementación de las siguientes tecnologías:
0.8um BiCMOS (AMS).
0.35um BiCMOS SOI (HITACHI).
0.35um SiGe (AMS).
0.35um CMOS (XFAB).
0.18um CMOS (SEIKO-EPSON).
65nm, 90nm & 0.18um CMOS (UMC).
65nm, 90nm & 0.13um CMOS (TSMC).
55nm BiCMOS (ST).
