txtPredicción de fiabilidad de circuitos integrados

Reliability prediction of integrated circuits

circuitos integrados

Bullet Description

Ceit has extensive experience in predicting reliability of integrated circuits. The following points summarize the main capabilities:

  • Tools for the controlled generation of cracks and prediction of their progress in structures that show patterns.

  • Study of cohesive / adhesive failure through the use of cohesive elements in MCSN.

  • Adhesive or cohesive failure analysis in MCSN.

  • Comparison between experiments and modeling. Influence of the toughness of the ES-Cu interface on M1

Comparación entre experimentos